Loop-H3308R Ethernet over Bonded Rack Card
 
 

 

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l      For C5600 Multi-Services Shelf

l      Ethernet point to point applications

l      WAN Ports

l     2, 4, or 8 pairs G.SHDSL.bis

l     Line rate 5.704 Mbps each G.SHDSL pair

l     Sealing current

l     STU-C (master) or STU-R (slave) mode selectable

l     G.SHDSL.bis using 16-TCPAM and 32-TCPAM

l     Supports auto-adaptive rate

l      Tributary Ports

l     2 10/100M fast Ethernet

l      Single/Dual slot

l     Single slot for 2/4 pairs G.SHDSL.bis card, and 15 Loop-H3308-R plug-in cards in each C5600 shelf

l     Dual slot for 8 pairs G.SHDSL.bis card, and
7 Loop-H3308-R plug-in cards in each C5600 shelf

l      Built in self-test and BERT functions

l      Bonding

l     Bonding protocol IEEE 802.3ah 2Base-TL

l     Line cut resilience within 50ms

l     Supports manual addition or removal of pair (s) without disrupting the service bandwidth

l     Ratio between the highest and lowest G.SHDSL.bis line rates can be up to 4:1

l      Firmware download

l      Configuration upload and download

l      Remote Ethernet Link Fault Propagation (LFP)

l      Standards compliance

l     ITU-T G.991.2 (G.SHDSL.bis Annex F) and G.994.1

l     IEEE 802.3ah 2Base-TL

l      RoHS Compliant

 

 
 
The Loop-H3308-R plug-in card provides high-speed digital transport for Ethernet and point to point applications. The rack card converts Ethernet ports over multiple twisted copper pairs by using the 16-TCPAM, 32-TCPAM (G.SHDSL.bis) technology, and the IEEE 802.3ah 2Base-TL bonding protocol. There are 2, 4, or 8 pairs configuration for the G.SHDSL.bis interface. The total bonded bandwidth is dependant on the number of copper wires.

 

The Loop-H3308R works as a pair (as master and slave). The rack card is intended to be plugged into Loopˇ¦s rack cage Loop-C5600 for central office use. The distance that this technology can span without repeaters is dependent on the data rate. The Loop-H3308R supports configuration and diagnostics by using a local terminal or a remote Telnet or SNMP manager. This allows execution of diagnostics and fault isolation.

 

The bonding method ensures line cut resilience by removing failed pair(s) from an aggregation group within 50ms. This removal decreases service bandwidth. When the failed pair(s) has recovered, the aggregation bandwidth will become normal without disrupting the service. For user maintenance, the Bonding G.SHDSL.bis system supports manual addition or removal of pair(s) without disrupting the service bandwidth of the remaining pair(s).G. SHDSL.bis supports different line rates. The ratio between the highest and lowest line rates can be up to 4:1.

 

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